Prajak Jattakul, D.Eng.
Lecturer, Department of Industrial Engineering, Establishment Project Faculty of Integrated Engineering and Technology, Rajamangala University of Technology Tawan-Ok, #ChanthaburiCampus
Google Scholar Profile: https://scholar.google.com/citations?user=H3UHIygAAAAJ
Effects of Ni Content on Melting Behaviors and Wettability of SnBiAgNi Lead-Free Solder. Materials Science Forum, vol. 1074, 2022, pp.119–123, https://doi.org/10.4028/p-zcw87p
An Investigation on Influence of Mn-doped TiO Nano-Particles on Melting Behavior, Wettability and Intermetallic Layer of SAC305+0.5In Lead-Free Solder Paste. The journal of Manufacturing and Management Technology (JMMT), 2022, vol. 1 no. 1, pp. 39-47, https://ph01.tci-thaijo.org/inde.../jMMT/article/view/247488
Optimization of reflow soldering processes solder on Ni substrate. The 7th Rajamangala Manufacturing & Management Technology Conference 2022 (RMTC 2022) 6-8 July 2022, Kantary Hotel Korat Nakhon Ratchasima, pp.351-358, https://shorturl.asia/U4sY6